Professor of mechanical engineering specializing in the areas of heat transfer, combustion, and energy systems.  Research activities in thermal systems and thermal management. Also an expert in thermofluid issues in emerging technologies and microthermal systems with interests in micro and nano engineering.  Has industry experience including in the analysis of thermal processes in semiconductor interconnection technology.

Formal Education

  • Ph.D. in Mechanical Engineering & Applied Mechanics, U. Penn.
  • M.S. in Mechanical Engineering, State University of New York
  • B. Tech. in Mechanical Engineering, Indian Institute of Technology

Career Highlights

  • Former site director of an NSF-funded industry-university cooperative research center on energy-smart electronic systems
  • While a Guest Researcher at a major national laboratory, investigated thermal issues in electronics packaging and modeled semiconductor manufacturing processes
  • Conducted research on liquid immersion cooling of electronic equipment for over three decades, initially while on the faculty of a U.S. military academy
  • Member of an international defense organization's technical team involved in validating thermal models of military power systems
  • Taught short courses in thermal management of data centers 
  • Named inventor on a pair of issued U.S. patents including one for novel methods and systems for thermal management
  • Prolific author of journal and conference papers, book chapters and articles with on the order of five hundred total publications
  • Contributing editor of three books, including one on thermal management of data centers and another on thermal challenges in electronic systems

Expert Qualifications

  • Deposed as an expert witness on behalf of the plaintiff in a patent infringement litigation in the U.S. District Court for the Northern District of California relating to a computer cooling system
  • Submitted multiple expert reports and was deposed in a patent case relating to technology for photo-voltaic solar power inverters

 

 

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Frequently Asked Questions

What types of cases can this expert support?

This expert can address cases involving data center thermal design, semiconductor manufacturing and packaging, immersion cooling systems, and military or aerospace thermal problems. They've spent decades researching and developing solutions in each of these areas.

What is this expert's technical background?

Ph.D. in Mechanical Engineering from Penn, M.S. from SUNY, B.Tech from IIT. They've done 30+ years of research on liquid immersion cooling, worked at NIST on semiconductor thermal issues, directed an NSF research center on energy-smart electronics, and published roughly 500 papers with two U.S. patents in thermal management.

What technologies does this expert specialize in?

Data center cooling, electronics packaging, immersion and indirect liquid cooling, thermal modeling, and thermofluid sciences. They've also taught short courses on data center thermal management and have industry experience analyzing thermal processes in semiconductor interconnection technology.