With over 40 years of expertise in semiconductor packaging and IC assembly technologies, this expert is recognized as a leading authority in flip chip bumping and wafer-level packaging processes. As Managing Partner of a specialized consulting firm, he has provided extensive expert witness services and consulting on IC packaging technologies ranging from solder bumping through final assembly. His career includes senior technical leadership roles at prominent semiconductor companies, where he guided the development of advanced packaging technologies and held key R&D positions.

Formal Education

  • Bachelor of Science in Mechanical Engineering from a major research university
  • Master of Science in Manufacturing Systems from a major research university

Career Highlights

  • Managing Partner of a specialized consulting firm providing expert witness services and consulting on IC packaging technologies from solder bumping through assembly
  • VP Technology and CTO at a semiconductor equipment manufacturer, leading all R&D in flip chip bumping and WLP technologies and achieving significant market penetration
  • VP and CTO at a semiconductor packaging technology company, directing all R&D in image sensor packaging and establishing comprehensive IP strategy
  • Advisory Engineering Manager at a major semiconductor manufacturer, responsible for flip chip equipment and process engineering for multi-chip modules in computing systems
  • Product Manager at a leading semiconductor equipment manufacturer, launching pioneering flip chip placement equipment to market
  • Chair of a major industry technical working group and organizer of industry workshops; recipient of recognition awards from professional organizations
  • Holds 13 issued U.S. patents covering flip chip, chip scale packaging, and assembly innovations, plus 40+ peer-reviewed publications

Expert Qualifications

  • Testifying expert in multiple semiconductor packaging patent disputes; prepared expert reports and testified at trial
  • Consulting expert in numerous semiconductor technology patent cases and disputes involving major industry participants
  • Extensive background as consulting and testifying expert in multiple district court and ITC cases, plus numerous IPR proceedings, specializing in semiconductor packaging and IC assembly technologies